This laboratory conducts research in the field of electronic packaging, which belongs to the semiconductor post-processing industry. We develop micro-sized metal or polymer bonding materials containing micro- and nano-sized fillers, and evaluate the bonding characteristics, mechanical, electrical properties, and reliability of the bondlines. The research themes of this laboratory are useful for broadening the understanding of materials engineering, including not only metals but also polymers, ceramic materials, and composite materials mixed with them. In addition, these research themes can be considered as key technologies for the Korean electrical and electronic industries. We have equipment such as hot plate, reflow oven, homogenizer, paste mixer, dispenser, vacuum oven, pulse rectifier, ultrasonic sonotrode, and glove box for conducting experiments.